Nexcom Vehicle Computer-CORE – VTC 7260-5HCIoT/7HCIoT

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Nexcom Vehicle Computer-CORE – VTC 7260-5HCIoT/7HCIoT

Fan-Cooled AI-Enabled Vehicle Computer with Intel® Core™ 11th Gen CPU

Key Feature

  • Intel® 11th Gen Tiger Lake UP3, cost-effective performance
  • Compact, rugged and fanless design
  • Rich I/O, 4 x PoE+, GbE, 4 x USB 3.2/2.0 and 2 x RS232/422/485
  • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
  • Combination of up to 3 LTE/5G, Wi-Fi 5/6 for mobile router function
  • Triple display for multiple video outputs, VGA, HDMI and DP
  • 9~36V DC-IN with ignition control and OCP/OVP
  • Wide operating temperature range of -30°C~60°C (15W TDP&PoE)
  • Military standard for vibration/shock resistance in OHV applications
  • CE/FCC, UKCA, Emark Certified

Request a Quote Datasheet

The VTC 7260-5HCIoT/7HCIoT is an in-vehicle AI-enabled telematics computer designed with Intel 11th Gen Tiger Lake UP3, which delivers 25% more processing power than the previous generation. Moreover, its 10-year product life can meet the long-term support suitable for any in-vehicle application. With its compact, rugged and fanless design, the VTC 7260-5HCIoT/7HCIoT can be easily mounted in any limited cabin space and reduces maintenance effort while serving 24/7. In addition, the VTC 7260-5HCIoT/7HCIoT features various peripherals such as 2.5GbE, PoE+, USB 3.2, isolated CANBus, serial ports, ultra-fast NVMe storage, triple display, audio in/out, DI/DO and IGN control with 9~36VDC, which makes it an advanced in-vehicle computer.

To work as an edge AI, users can install LTE/5G/Wi-Fi 5/6 modules together with a Hailo AI accelerator (26TOPS) to deploy AI services provided from the cloud SaaS. Considering harsh environment applications, the VTC 7260-5HCIoT/7HCIoT can operate in a temperature range of -30°C~60°C (15W TDP and PoE) and complies with the MIL-STD-810G military standard for vibration/shock. For regulation, the VTC 7260-5HCIoT/7HCIoT complies with CE/FCC Class A, UKCA and EMARK (E13).

rocessor Intel® Core™ 11th Gen Tiger Lake UP3Core i5-1145GRE, base frequency 1.5 GHz/ 2.6 GHz, 4c, 8 MB Intel® Smart Cache (VTC 7260-5HCIoT)TDP boot mode in BIOS setting: Nominal (15W)Core i7-1185GRE, base frequency 1.8 GHz/ 2.8 GHz, 4c, 12 MB Intel® Smart Cache (VTC 7260-7HCIoT)Graphics:
- Intel® Iris® Xe graphics, 1.3 GHz
- Maximum resolution: 4096 x 2304@60 Hz (HDMI)
- DirectX: 12.1, OpenGL: 4.6
Memory 2 x SO-DIMM, DDR4-3200MHz4GB+4GB by default, maximum 64GB.ECC (in-band ECC), dual channel support
Storage 1 x 2.5” SSD (15 mm height)1 x mPCIe for mSATA (SATA 3.0)1 x M.2 2242/2280 Key M NVMe SSD (PCIe 4.0 x4), optional Hailo AI card
Expansion slots 1 x mini-PCIe socket (PCIe 3.0/USB 3.2 + USB 2.0), 2 x micro SIM supported1 x M.2 3042/3052 Key B socket (USB 3.2), 2 x micro SIM supported1 x M.2 2230 Key E socket (PCIe 3.0 x2 and USB 2.0), Wi-Fi or Hailo AI card optional)
Display 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz1 x VGA, up to 2560 x 1600@60Hz1 x DP, 4096 x 2304@60Hz
PoE+ 4-port independent 2.5 GbE, RJ45 connector
- IEEE 802.3 af/at, 60 W total
- 9 K bytes jumbo frame
- PTP (IEEE 1588) support
- Controller: Intel® I225-IT
Carry 1-port independent GbE, RJ45 connector
- vPro (iAMT) support
- 9K bytes jumbo frame
- PTP (IEEE 1588) support
- Wake on LAN (WoL)
- Boot from PXE (UEFI)
USB 3 x USB 3.2 Gen1:
- Host type A connector
- 5V@900mA each
- Up to 10Gbit/s link speed and USB 2.0 (LS/FS/HS link speed) compatibility1 x USB 2.0, host type A, 2 x USB 2.0 wafer type reserved
Serial Port 2 x full RS232/422/485, selectable2 x full RS232 chip type reserved
- RS232 operating voltage, +-9V, baud rate up to 115.2kb/s
Security TPM 2.0: Infineon SLB9670VQ2.0 FW7.62
Audio Line-out, unbalanced stereo, left and right channelsMIC-in, stereoLine-in reserved (wafer connector)
MEMS Sensor 3D accelerometer and 3D gyroscopeController: ST LSM6DSLTR
OF/THO 4-bit input
- Source: 9~36VDC (12V@1.1mA/24V@2.2mA)
- External: 0~33VDC pull-high, high level, 3.3-33 VDC; low level, 0-2 VDC4-bit output
- Source: 9~36VDC (nominal 35mA@24V):
- External: 5~27VDC pull-high, sink current with 220mA for each bit, 500mA max (@25C)Selectable via source or external DIP switch (default: source type)
CAN bus 1 x CAN 2.0A/ 2.0BIEC 61000-4-2 Electrostatic Discharge (ESD): ± 8KV/15KV (contact/air)2.5KV isolated
GNSS U-blox NEO-M9N GNSS module for GPS/GLONASS/QZSS/Galileo/BeidouOptional DR (Dead Reckoning) function, NEO-M8U/M8L
Power Supply Nominal voltage: 9~36VCranking voltage: 6V~9V (less than 20 seconds)OCP and UVP (shuts down when exceeding 37V)Ignition on/off control and programmable on/off delay timerOptional for remote power on/off control
I/O ports, Front plate ŒŒ ATX power button, Reset buttonŒŒ 9 x LED Indicators, 1 x VGA (DB15), 2 x COM (DB9, RS232/422/485), 1 x Multi-port (DB15, 4 x DI, 4 x DO, CAN, DR signal), 1 x External (DB15, reserved), 1 x PR-SMA for GNSS, 4 x PR-SMA for WLAN
I/O ports, Rear plate 2 x Audio jack (Line-out and MIC-in)3 x USB 3.2 type A, 1 x USB 2.0 type A1 x HDMI, 1 x DP, 4 x PoE+ (2.5 GbE, RJ45), 1 x GbE, 9~36 VDC (3-pin Phoenix)4 x SMA for WWAN, 4 x antenna holes reserved
I/O ports, side plate 2 x SIM slots (SIM1-1, SIM2-1)
Dimensions and Weight 210.0 mm x 173.0 mm x 75.0 mm (without mounting brackets)234.0 mm x 173.0 mm x 81.0 mm (with mounting brackets)Weight: 3.5 kg
Environment Operating temperatures: -30°C~60°C (15W TDP and PoE)Storage temperatures: -40°C~85°CRelative humidity: 10%~95% (non-condensing)
Vibration and Shock Vibration during operation:
- MIL-STD-810H, 514.8C Procedure 6, Category 4
- IEC 60068-2-64: 2.0g@5~500HzVibration during storage:
- MIL-STD-810G, 514.6E Procedure 1, Category 24, 7.7 gShock:
- MIL-STD-810G, 516.6 Procedure I, trucks and semi-trailers = 40 g
- Crash hazard: Procedure V, ground equipment = 75 g
Certifications CE approval, FCC Class A, UKCA, E13 Certified
Operating System Linux (Ubuntu 18.04)
External Cable (optional) DB15 multi-port adapter cable, 20cm
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