Nexcom Fanless Box PC – NISE 53-E01/E02

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Nexcom Fanless Box PC – NISE 53-E01/E02

Intel® Celeron® Processor J6413 Quad-Core Fanless System

Key Feature

  • Built-in Intel® Celeron® processor J6413, 1.8 GHz or Atom® processor x6211E, 1.3 GHz
  • 3 x HDMI (triple display)
  • 2 x USB 3.0, 2 x USB 2.0
  • 1 x RS232/485, 1 x RS232/485 with auto flow control
  • 3 x GbE LAN ports
  • 1 x Full-size mini-PCIe
  • 1 x Front-accessible M.2 Key B
  • 1 x Internal M.2 Key B
  • Supports operating temperature from -10°C to 60°C
  • Supports +12V/24V DC input; supports ATX power mode

Request a Quote Datasheet

The NISE 53 is a fanless computer powered by the latest generation Intel ® Celeron ® J series and Atom ® x6000 series (formerly codenamed “Elkhart Lake”) processors. It delivers power-efficient performance designed for next-generation industrial edge-connected embedded systems requiring high-resolution graphics and low power consumption, such as industrial automation, smart transportation, retail and smart city IoT solutions. The NISE 53 can operate over an extended temperature range of -10°C to 60°C, demonstrating its reliability in industrial environments. The NISE 53 supports up to 3 simultaneous display outputs and offers superior graphics capabilities through its Intel ® UHD graphics 16EUs. The NISE 53 has powerful connectivity - 3 x GbE LAN ports and 2 x COM ports, mainly for Modbus TCP or Modbus RTU communication. The NISE 53 supports efficient scalable networks and storage configurations with an internal 1 x M.2 slot for 4G LTE, 1 x full-size mini-PCIe slot for Wi-Fi and Bluetooth, and a front-accessible 1 x M.2 slot for storage. The NISE 53 provides performance, integration and versatility for industrial environments, offers a lower total cost of ownership, and supports 12 VDC/24 VDC and built-in TPM2.0 for enhanced security.

CPU Support Built-in Intel® Celeron® J6413 processor, 1.8 GHzBuilt-in Intel Atom® processor x6211E, 1.3Ghz
Main Memory 1 x DDR4 3200 buffered Non-ECC SO-DIMM socket, supports up to 16 GB
Display Option Triple independent display support
- 3 x HDMI, resolution 1920 x 1080 @ 60Hz
I/O Interface - Front ATX power on/off switch3 x HDMI1 x Intel® I226V GbE LAN port2 x Marvell SOC PHY GbE LAN ports2 x USB 2.0 (900mA each)1 x 2-pin remote power on/off switch
I/O Interface - Rear 2 x USB 3.1 ports (500mA each)2 x DB9 for COM1 and COM2
- COM1: RS232/485, supports TX/RX/CTS/RTS only, with auto flow control
- COM2: RS232/485, supports TX/RX/CTS/RTS only1 x 3-pin terminal block, supports +12/+24V DC input
I/O Interface - Internal 4 x GPI and 4 x GPO (programmable as GPI or GPO)
Storage Device 1 x Optional onboard 32 GB EMMC
Expansion Slot 1 x Internal nano SIM card holder1 x Full-size mini-PCIe for Wi-Fi/BT/4G LTE/storage1 x Front-access M.2 Key B for 4G LTE/ PCIe and SATA storage1 x Internal M.2 Key B for 5G/4G LTE
Power Requirements AT/ATX power mode (default: ATX power mode)Power input: +12/+24V DC input
Supported Operating Systems Windows 11Windows® 10 Enterprise 64 bitLinux Kernel version 4.19
Dimensions 186 mm (W) x 150 mm (D) x 26 mm (H)
Construction Metal chassis with fanless design
Environment Operating temperature
- Ambient with air flow: -10°C to 60°C (according to IEC60068-2-1,IEC60068-2-2, IEC60068-2-14)Storage temperature: -40°C to 85°CRelative humidity: 10% to 90% (non-condensing)Shock protection
- M.2/mSATA: 50G @ wall mount, half sine, 11ms (operating), IEC60068-2-27Vibration protection with M.2/mSATA condition:
- Random: 2Grms @ 5~500 Hz, IEC60068-2-64
- Sinusoidal: 2Grms @ 5~500 Hz, IEC60068-2-6
Certifications BUFCC Class A
Driver
Date Description Version OS Download
2023-09-25 Chipset Windows 3.86 MB
2023-09-25 CSE Windows 849.72MB
2023-09-25 Graphics Windows 425.34MB
2023-09-25 HID Event Filter Windows 0.05MB
2023-09-25 Network Driver Windows 1.39MB
2023-09-25 ME PSE Windows 0.35MB
2023-09-25 Serial IO.zip Windows 0.69MB
Manual
Date Description Version OS Download
2023-10-26 User Manual Windows User Manual
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