Nexcom Fanless Box PC – NISE 110-A01/A02

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Nexcom Fanless Box PC – NISE 110-A01/A02

Fanless System with Intel 12th Gen Alder Lake-N Processor

Key Feature

  • Built-in Intel Celeron® Processor N97 quad-core 2.0Ghz or Atom® Processor x7211E dual-core 1.0Ghz
  • 2 x display outputs, 1 x HDMI and 1 x DP port
  • 3 x Intel® I226-IT 2.5GbE TSN LAN ports; WoL, teaming and PXE support
  • Storage support: mSATA and M.2 SATA & PCIex2 modules
  • 1 x mini-PCIe Wi-Fi/LTE wireless module
  • 2 x USB3.2
  • 2 x USB2.0
  • 2 x DB9 for RS232/422/485
  • 2 x DB9 for RS232
  • Supports -40°C~70°C extended operating temperature
  • Supports 9~30VDC input; supports AT/ATX power mode

Request a Quote Datasheet

Latest generation Intel Celeron ® N97 Quad Core or Atom ® x7211E Dual Core (formerly codenamed “Alder Lake–N”) powers the NISE110-A01/A02, delivering outstanding performance not only in computing but also in graphics and offering a brand-new opportunity for both smart and industrial computing solutions. With up to 16G DDR4 memory, the NISE 110 offers various options in storage devices such as M.2 and miniPCIe. The NISE 110 has high integration capability with 3 x TSN 2.5GbE LAN ports and 4 x COM ports (2x RS232 and 2xRS232/422/485), making it a truly smart system for various applications such as factory automation applications, network applications (with optional Wi-Fi module and 5G/4G/LTE module) and communication applications (with optional GPIO, RS232/422/485). For more demanding environments, the NISE110 also provides an extended operating temperature SKU of -40 to 70 degrees C.

CPU Support A01: Built-in Intel Celeron® Processor N97 quad-core 2.0GhzA02: Built-in Intel Atom® x7211E dual-core 1.0Ghz
Main Memory 1 x DDR5 4800 SO-DIMM socket, supports up to 16 GB
Display Option Dual independent displays: HDMI + DP
I/O Interface - Front ATX power on/off switchLED indicators: power status, RTC battery low, programmable3 x Intel® I226-IT 2.5GbE TSN LAN ports; WoL, teaming and PXE support2 x USB3.2 ports1 x HDMI port1 x DB9 for COM1, RS232 support only1 x optional I/F opening for optional function output or module interface use1 x 3-pin DC input, supports +9 to 30VDC input
I/O Interface - Rear 2 x USB2.0 ports1 x 2-pin remote power on/off switch1 x DisplayPort1 x DB9 for COM2, RS232 support only2 x DB9 for COM3 and COM4, auto flow control, supports RS232/422/485 via BIOS setting
I/O Interface - Internal 4 x GPI and 4 x GPO (5V, TTL type)1 x NANO-SIM holderTPM2.0 (optional)Mic-in / Line-out (optional)
Storage Device 1 x miniPCIe for mSATA1 x M.2 Key B 2242/2280 for SATA/PCIex2 SSD
Expansion Slot 1 x mini-PCIe socket supports optional Wi-Fi/4G LTE modules1 x M.2 Key B socket supports optional 5G/4G LTE/storage modules
Power Requirements Power input: +9 to 30V DC1x Optional 24V, 60W power adapter
Dimensions 185 mm (W) x 131 mm (D) x 56 mm (H) without wall mount bracket
Construction Aluminum chassis with fanless design
Environment Operating temperature Ambient with air flow (according to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)
- A01:-40 to 60℃
- A02:-40 to 70℃Storage temperature:-40℃ to 80℃Relative humidity: 95% at 40℃Shock protection:
- HDD: 20G @ wall mount, half sine, 11ms (operating), IEC60068 2-27
- M.2: 50G @ wall mount, half sine, 11ms (operating), IEC60068 2-27Vibration protection w/ M.2 and SSD condition:
- Random: 2Grms@ 5~500 Hz, IEC60068-2-64
- Sinusoidal: 2Grms@ 5~500 Hz, IEC60068-2-6
Certifications CE approval
- EN61000-6-2
- EN61000-6-4FCC Class A
Operating System Support Windows 10 IoT Enterprise, 64-bitWindows 11Linux Kernel Version 4.1
Weight Information 3.1 kg
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