Nexcom Fanless Box PC – NISE 70

Intel® 11th Gen Core-i/ Celeron Processor Dual-Core Fanless System

Key Feature

  • Built-in Intel® 11th Gen Core-i/ Celeron Processor
  • 4 x HDMI
  • 3 x USB 3.0, 1 x USB 2.0
  • 1 x RS232/422/485, 1 x RS232
  • 3 x GbE LAN ports; WoL, teaming and PXE support
  • Built-in TPM 2.0 chip
  • 1 x M.2 socket for storage/4G LTE/5G modules
  • 1 x mini-PCIe socket supports optional mSATA/Wi-Fi/BT/4G LTE module
  • Supports operating temperature from -10°C to 60°C
  • Supports +12V to 24VDC input; supports ATX power mode

Request a Quote Datasheet

Latest generation Intel ® Core™ and Celeron ® processors (formerly codenamed "Tiger Lake-UP3") power the NISE 70, a fanless computer designed for industrial applications requiring low power consumption and abundant I/O interfaces but limited installation space.

 

The NISE 70 supports a wide operating temperature range from -10°C to 60°C and a wide DC power input range from 12V to 24V. The NISE 70 is also the first system in the slim NISE 50 series to support 4 independent displays and up to 32GB of DDR4 3200MHz memory. The NISE 70 has powerful connectivity - an Ethernet-based LAN port and a traditional Serial port, mainly for Modbus TCP or Modbus RTU communication. For wireless connectivity, it has 1 x mini-PCIe socket and 1 x M.2 socket that can support optional wireless modules for IoT applications, such as Wi-Fi, Bluetooth, 4G LTE, 5G modules and a storage module. The NISE 70 is definitely the best choice for an M2M smart system as a smart IoT gateway.

CPU Support Built-in Intel® 11th Gen Core-i/ Celeron ProcessorSupports Intel® Core™ i7/i5 Tiger Lake-UP3 processors with different SKUs
Main Memory 1 x DDR4 3200 SO-DIMM socket, supports up to 32 GB
Display Option 4 x HDMI ports, supports 4K@30Hz
I/O Interface - Front ATX power on/off switch4 x HDMI ports, supports 4K@30Hz2 x Intel® I211 and 1 x Intel® WGI219LM GbE LAN ports;Supports WoL, teaming and PXE1 x Antenna hole
I/O interface - Rear 3 x USB 3.0 ports (900mA each)1 x USB 2.0 (500mA each)2 x DB9 for COM1 and COM2
- COM1: RS232/422/485 auto flow control
- COM2: full RS232 signal
1 x 2-pin remote power on/off switch2 x Antenna holesSupports +12V to 24V DC input
I/O Interface – Internal 4 x GPI and 4 x GPO (programmable as GPI or GPO)
Expansion Slot 1 x mini-PCIe socket for optional Wi-Fi/BT/4G LTE/mSATA1 x M.2, supports Key B and B+M module for optional 4G LTE/5G/SATA storage (SATA/PCIe/USB, 2242/3042)
Power Requirements Power input: +12 to +24V DC1 x Optional 24V, 60W power adapter
Supported Operating Systems Windows® 10 Enterprise 64 bitLinux Kernel 4.19
Dimensions 198.8 mm (W) x 150.4 mm (D) x 37.7 mm (H) with wall mount bracket
Construction Aluminum and metal chassis with fanless design
Environment Operating temperature:
Ambient with air flow: -10°C to 60°C (according to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)
Storage temperature: -20°C to 80°CRelative humidity: 10% to 95% (non-condensing)Shock protection:
- M.2/mSATA: 50G, half sine, 11ms, IEC60068-2-27
Vibration protection with mSATA & M.2 condition:
- Random: 2Grms@5~500 Hz, IEC60068-2-64
- Sinusoidal: 2Grms@5~500 Hz, IEC60068-2-6
Certifications BUFCC Class A
Driver
Date Description Version OS Download
2022-06-02 Chipset Windows 3.45 MB
2022-06-02 CSME Windows 674.6 MB
2022-06-02 Graphics Windows 425.02 MB
2022-11-22 IGFX Windows 418.07MB
2022-06-02 Network Windows 121.62 MB
2022-06-02 NEGATIVE Windows 3.67MB
Manual
Date Description Version OS Download
2021-08-03 Quick Reference Guide Windows 0.39MB
2022-06-17 User Manual Windows 6.12MB
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