Nexcom Train Computer – ATC 3750-6C

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Nexcom Train Computer – ATC 3750-6C

NVIDIA® Jetson AGX Orin™ Solution Performance Edge AI Computing

Key Feature

  • Built-in NVIDIA® Jetson AGX OrinTM SOM, performance up to 200/275 TOPS (INT8)
  • Designed with rugged, compact and hybrid cooling solutions
  • 6-port GbE PoE+ for IP CAM/LiDAR sensors, optional 1-port 10GbE
  • HEVC/H.265 hardware DECODE up to 7 x 4K30 performance
  • Wide operating temperature range of -20°C~70°C
  • Ultra-fast PCIe 4.0 x4 NVMe SSD for data integrity
  • Expandable for GNSS, LTE/5G NR and Wi-Fi 5/6
  • 9~36V DC-IN with ignition control and OCP/OVP
  • Integrated with NEXCOM Acceleration Linux (NAL) JetPack 6.0
  • MIL-STD-810H military standard for vibration/shock resistance
  • CE/FCC, UKCA, E-mark Certified

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AI has become a key component of automated vehicle technologies. With the built-in high-performance NVIDIA® Jetson AGX Orin™ SOM, the ATC 3750 can deliver workloads of up to 200/275 TOPS in Artificial Intelligence (AI) processing and inference, and supports applications such as ADAS, ANPR, AMR, Machine Learning (ML), ITS and factory automation in Transportation/Construction.

To run workloads at 200/275 TOPS in harsh environments, users can add an exhaust fan kit to enable hybrid heat dissipation. The fan can be controlled depending on the operating temperature and the TDP (15W~60W) of the respective processor.

The ATC 3750 is a rugged, compact-sized in-vehicle AI-enabled computer with 9~36VDC with IGN control, 6 PoE+ for access to IP CAM/LiDAR sensors and rich peripheral ports, USB 3.2, isolated CANBus, RS232, Console, DI/DO, OTG and HDMI. With the installation of 5G NR and Wi-Fi 5/6 modules, the ATC 3750 can cooperate with CPS for AI model retraining, making it suitable for deployment in complex applications such as ADAS/ANPR/AI-enabled ITS/Construction. In harsh environments, the ATC 3750 can operate over a wide temperature range of -20~70°C and meet the MIL-STD-810H military standard for vibration and shock resistance. For regulation, the ATC 3750 is certified by CE/FCC Class A, UKCA and E-mark (E13).

NVIDIA®
Jetson AGX Orin™ SOM		 32 GB 256-bit LPDDR5, 204.8 GB/s (ATC 3750-6C)
- 8 x cores | 2 Cortex-A78AE CPU clusters (4 cores per cluster), 2.2 GHz
- 1792 CUDA® cores, 56 Tensor cores, 108 Sparse TOPS, 939 MHz
- 200 INT8 Sparse TOPS
- 2 x NVDLA v2.0 engines: 1.4 GHz | 46 TOPS each (Sparse INT8)64 GB 256-bit LPDDR5, 204.8 GB/s (ATC 3750-6C-64)
- 12 x cores | 3 Cortex-A78AE CPU clusters (4 cores per cluster), 2.2 GHz
- 2048 CUDA® cores, 64 Tensor cores, 170 Sparse TOPS, 1.3 GHz
- 275 INT8 Sparse TOPS
- 2 x NVDLA v2.0 engines: 1.6 GHz | 52.5 TOPS each (Sparse INT8)Video Encoding: 2 x 4K60 | 4 x 4K30 | 8 x 1080p60 (H.265)Video Decode: 1 x 8K30 | 3 x 4K60 | 6 x 4K30 | 12 x 1080p60 (H.265)OpenGL 4.6+, OpenGL ES 3.2 and Vulkan 1.2+, CUDA 10.2+NVIDIA® JetPack 6.0
Storage 64 GB eMMC 5.1 flash storage, 200 MHz (HS400 or HS533)1 x Accessible SD card (SDXC-I/ UHS-I, SD3.0)1 x M.2 2280 Key M (PCIe4.0 x4), NVMe SSD
Expansion 1 x Full-size mPCIe socket (PCIe 4.0, USB 2.0)1 x M.2 3042/3052 Key B socket (USB 3.2/2.0), 2 x Nano SIM slots1 x M.2 3030 Key E socket (PCIe 4.0, USB 2.0) for Wi-Fi 5/6
Display 1 x HDMI 2.0A/B, up to 3840 x 2160@60Hz
G-Sensor 3D accelerometer and 3D gyroscope, ST LSM6DSLTR
PoE+ 6-port GbE, RJ45 connector
- 9 KB Jumbo frame
- IEEE 802.3 AF/, 80 W total
- IEEE1588 supported
- PSE ON/OFF and Watt monitoring
- GIGA LAN SWITCH: KSZ9477STXI
USB 2 x USB 3.2 Gen 2:
- Host Type-A connector
- 5V@900mA each
- Up to 10Gbit/s link speed and USB 2.0 (LS/FS/HS link speed) compatibility1 x OTG, micro USB
Serial Port 2 x RS232 (Tx, Rx, RTS, CTS)1 x Console (Tx, Rx)RS232 operating voltage, ±9V, baud rate up to 115.2kb/s
OF/THO 4-bit input
- Source: 9~36VDC (12V@1.1mA/24V@2.2mA)
- External: 0~33VDC pull-high, high level, 3.3-33 VDC; low level, 0-2 VDC4-bit output
- Source: 9~36VDC (nominal 35mA@24V)
- External: 5~27VDC pull-high, sink current with 220mA for each bit, 500mA max (@25C)Source or external selectable by software (default: source type)
CAN Bus 2 x CAN FD, compatible with CAN2.0A/2.0BIEC 61000-4-2 Electrostatic Discharge (ESD): ± 8KV/15KV (contact/air)Up to 5 Mb/s in data transmission, 2.5 KV isolated
10GbE, RJ45 (optional) Ethernet PHY: Marvell AQR113C-BO-I10GBASE-T/5GBASE-T/2.5GBASE-T/1000BASE-T/100BASE-TX/10BASE-TCompliant with IEEE 802.3az9Kbyte Jumbo frameIEEE1588 supported
GNSS u-blox NEO-M9N GNSS module for GPS/GLONASS/QZSS/Galileo/BeidouOptional DR (Dead Reckoning) function, NEO-M9V/M8L
Power Supply Nominal voltage: 9~36VCranking voltage: 6V~9V (less than 20 seconds)OCP and UVP (shuts down when exceeding 37V)Ignition on/off control and programmable on/off delay timerOptional for remote power on/off control
I/O Ports, Front Plate ATX power buttonReset button12 x LED Indicators2 x USB3.2 Type AConsole (DB9)2 x CAN (DB9)COM1/RS232 (DB9)2 x Nano SIM1 x HDMI1 x SD1 x OTG
I/O Ports, Rear Plate COM2/RS232 (DB9)6x RJ45 (GbE PoE+)1 x Multi (DI/DO, DR signal)1 x SMA for GNSS2 x RP-SMA for Wi-Fi4 x SMA for LTE/5G9~36V DC IN
Dimensions and Weight 234.0 mm x 172.8 mm x 80.5 mm (with mounting bracket), weight: 3.5 kg234.0 mm x 184.5 mm x 103.6 mm (with exhaust kit and mounting bracket), weight: 4.2 kg
Environment Operating temperatures: -20°C~70°C (TDP 15W~60W, fanless, with 80W PoE)Operating temperatures: -20°C~70°C (TDP 50W/60W, with 80W PoE, with fan kit)Storage temperatures: -40°C~85°CRelative humidity: 10%~95% (non-condensing)
Vibration and Shock Vibration during operation:
- MIL-STD-810H, 514.8C Procedure 6, Category 4
- IEC 60068-2-64: 2.0g@5~500 HzVibration during storage:
- MIL-STD-810G, 514.6E Procedure 1, Category 24, 7.7 gShock:
- MIL-STD-810G, 516.6 Procedure I, trucks and semi-trailers = 40 g
- Crash hazard: Procedure V, ground equipment = 75 g
Certifications CE approval, FCC Class A, UKCA, E13 Certified
Operating System Integrated with NEXCOM Acceleration Linux (NAL) Jetpack 6.0NEXCOM special functions (GNSS, 5G/NR, 6-axis sensor, MCU control)Ubuntu 22.04 (L4T 36.3, Linux Kernel 5.15)
External Cable DB15 multi-port adapter cable, 20cm
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