Nexcom Train Computer – aROK 8110

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Nexcom Train Computer – aROK 8110

Intel® 8th/9th Gen Core™/Xeon® CPU + Enhanced Inference Accelerator AI for Autonomous and Machine Vision

Key Feature

  • Rolling stock AI recognition and machine vision applications
  • Up to 8 cores of Intel® 8th/9th Gen Core™/Xeon® CPU processing power
  • 4 x PCIe 3.0 slots for discrete graphics/inference/frame grabber cards
  • Ultra-fast NVMe M.2/U.2 media for high-speed multi-camera image capture
  • RAID 0/1/5/10 configurable for data security and integrity
  • 24/36 VDC input with ignition management
  • Special fixture design prevents vibration issues on GPU and PCIe cards
  • WWAN/5G NR, WLAN and GNSS functionality with up to 4 SIM slots
  • Complies with EN 50155 OT4 and MIL-STD-810G for vibration/shock with graphics card and PCIe card installed
  • Smart fan design with temperature-based RPMs

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AI has become a key component of autonomous vehicle technology. With built-in high-performance Intel® Coffee-Lake S/Refresh or Xeon® processing power and 4,352 CUDA® cores of the powerful NVIDIA® GeForce ® RTX 2080 Ti graphics engine, the aROK 8110 can meet a wide range of rolling stock applications such as rail obstacle inspection, traffic light and traffic sign recognition, pantograph inspection, and those that place great importance on graphics performance.

 

With the rapid growth of high-speed multiple cameras with high frame rates, extreme data storage speed has become more and more important. For this, the aROK 8110 is designed with up to 3 USB 3.1 and up to 12 GbE w/ PoE GigE M12 X-coded ports to achieve wire-speed performance for high-quality industrial cameras. In addition, the latest ultra-fast U.2/M.2 NVMe media and up to four 2.5-inch high-density SSD/HDDs are implemented to meet customers' integrity demands for large data streaming, security and installed multiple cameras.

 

The aROK 8110 also provides excellent expansion capability for users to install up to four add-on PCIe cards, such as frame grabbers on GigE Vision interfaces, or a separate graphics engine to boost graphics power. To locate where you are while the system is at the edge and to maintain connectivity with remote central management, the aROK 8110 is your best choice for providing telematics functionality such as up to two LTE/WLAN modems, GNSS with DR function, and eMTC, RS232/422/485 and CAN 2.0B modules working together with other communication ports.

 

The aROK 8110 is a more flexible design for users to choose the CPU they want to run. In addition, to work with discrete graphics cards of up to 250W RTX 2080 Ti, it can support up to 80W TDP workstation-class Xeon®'u can support .

Processor Intel® Coffee-Lake S/Refresh Core™/Xeon® i7/i5/i3/Pentium®/Celeron® processor (LGA1151)
PCH Intel® chipset C246
Memory Two 260-pin DDR4 SO-DIMM socketsUp to 32GB+32GB, 2400/2666 MHzSupported ECC memory: i3-8100/8100T, i3-9100T/9100TE, E-2124G, E-2278GE/2278GEL, G5400/5400T, G4900/4900
Storage 4 x 2.5” SATA 3.0 SSD/HDD (15 mm height) or 3 x 2.5” SATA 3.0 SSD/HDD + 2 x M.2 2242/2260/2280 Key M NVMe SSD (PCIe 3.0 x2) or 3 x 2.5” SATA 3.0 SSD/HDD + 1 x U.2 NVMe SSD (PCIe 3.0 x2/SATA 3.0)1 x CFast (externally accessible)
Expansion 1 x Full-size mPCIe socket (USB 2.0, PCIe 3.0)1 x Full-size mPCIe socket (USB 2.0) for LTE module, BOM optional M.2 3042 Key B socket (USB 2.0) for LTE module with 1 x external, 1 x internal SIM1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 1 x external, 1 x internal SIM1 x PCIe 3.0 x16 slot for discrete graphics card, up to 321 mm in length3 x PCIe 3.0 x4 slots, up to 240 mm in length
GigE/Frame Grabber (optional) 4-Port independent GbE w/ 802.3af/at, max. 60W, M12 X-coded
Discrete Graphics Card (optional) Up to NVIDIA® RTX 3090, 450W or higher
GPS and Sensor 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/BeidouBuilt-in G-sensor
Video 2-Port independent GbE LAN, M12 X-coded9K bytes jumbo framePTP (IEEE 1588) supportController: Intel® i210-T1, PHY: Intel® I219LMvPro (iAMT) and WOL support
Security TPM 2.0: Infineon SLB9660TT1.2-FW4.40
I/O Ports, Front Plate Waterproof DC input connector with ignition for 24/36 VDC-INPower buttonReset button6 x LED indicators for Power/IGN/WLAN/WWAN/LAN status4 x LED indicators for storage/fan control5 x LED indicators for user programming1 x USB 3.1 Gen2 + 1 x USB 2.0, type A1 x DB15 (CAN/DIO, 4 x DI/4 x DO + 1 x CAN 2.0B)1 x DB15 (EXT.), reserved for expansion7 x SMA antenna holes2 x DB9 (COM3/COM4) for RS232/RS422/RS485 selectable (isolated)
I/O Ports, Rear Plate 2 x USB 3.1 Gen2, type A1 x M12 A-coded connector for 2 x USB 2.02 x GbE (M12 X-coded)1 x VGA + 1 x HDMI2 x DB9 (COM1/COM2) for RS232/RS422/RS485 selectable (isolated)2 x SIM slots1 x SMA antenna hole for GNSS6 x SMA antenna holes1 x PCIe x16 lane slot3 x PCIe x4 lane slots1 x DB9 (AUDIO, female) for 1 x Mic-in (stereo), 2 x Line-out (stereo)
Display 1 x VGA port, up to 1920 x 1200@60Hz1 x HDMI v1.4, up to 4096 x 2160 at 30 Hz
DI/DO (isolated) 4-Bit input
- Source: 9~48V-IN (12V@1.1mA/24V@2.2mA)
- External: 0~33VDC pull-high, high level, 3.3 - 33 VDC; low level, 0-2 VDC4-Bit output
- Source: 9~48V-IN (nominal 35mA@24V)
- External: 5~27VDC pull-high, sink current with 220mA for each bit, 500mA max (@25C)Source or external selectable by software (default: source type)
Fan 1 x CPU fan1 x System fan
CAN 2.0B (isolated) CAN 2.0B (isolated)Controller: SJA1000Bit rate up to 1Mbit/sSocket CAN supported11-bit and 29-bit identifiers, ISO 11898-1, ISO 11898-2ESD: ± 8KV/15KV (contact/air)2.5KV isolated
Power Management 24/36 VDC-INCranking voltage: 6V~9V (< 30 seconds)Reverse protection, OCP and UVPIgnition on/off control/programmable on/off delay timer
Operating System Windows 10/Linux
Dimensions 215 x 385 x 205 (G x D x Y) (mm)
Weight 10.5 kg
Environment Operating temperatures
- EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (with 35W TDP CPU, industrial SSD) with airflowStorage temperatures: -40°C~85°CRelative humidity: 10%~95% (non-condensing)Vibration (random)
- IEC 60068-2-64 1.0 g@5~500 Hz (operating, HDD), 1.6 g for HDD with damping bracket
- IEC 60068-2-64 2.0 g@5~500 Hz (operating, SSD + graphics card)Vibration (SSD + graphics card)
- Operating: MIL-STD-810G, 514.6C, category 4
- Storage: MIL-STD-810G, 514.6, category 24, minimum integrity testShock (SSD + graphics card)
- Operating: MIL-STD-810G, Method 516.6, procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, procedure V, crash hazard shock test=75g
Certifications BUFCC Class AEN 50155: 2017
- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1
- Supply change-over class C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, on request)EN 45545-2: 2013+A1:2015
Manual (Please Contact the Sales Department )
Date Description Version OS Download
2022-03-10 User Manual (Datasheet Only) Windows 0.73MB
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