Nexcom Train Computer – nROK 7271

Fanless Railway Vehicle Computer with 12th/13th Gen Intel® Core™ CPU

Key Feature

  • Powered by 12th/13th Gen Intel® Core™ CPU
  • Fanless, compact and rugged design
  • Designed with DDR5, excellent memory bandwidth, lower latency
  • 2 x 2.5” SSD (compatible with 15 mm drives) for data integrity
  • Supports 5G/Wi-Fi, PoE, 10GbE and auxiliary card expansion
  • 4 x Independent 10/100/1000/2500 Mbps PoE 802.3af/at, total 60 W (nROK 7271-WIC4 without PoE expansion card) / 30 W (nROK 7271-WIC4 with PoE expansion card)
  • EN 50155, class OT3 compliant
  • Wide voltage input 24~110VDC (isolated)
  • Optional protection against transient voltage drops of up to 3 seconds

Request a Quote Datasheet

The NEXCOM nROK 7271 system delivers operational efficiency for public transport and service. Intel® 12th/13th Gen FCLGA1700 socket-type CPU and 4/12-port 802.3 af/at PoE form the basis of an integrated solution that houses high computing power. With dual SIM card support per modem, two SIM cards can back each other up for better connection quality by software. RAID 0, 1 with 2 x external SSD guarantees data security. The nROK 7271 further differentiates itself with power isolation for 24~110VDC and optional protection against transient voltage drops of up to 3 seconds, a critical feature for scenarios where input voltage variability could shut down the equipment. With its daughter-board expansion design, an additional 1 x mini-PCIe slot (BOM optional for M.2 Key E) and 2 x M.2 Key B slots, an 8-port 1 Gbps Ethernet Switch GbE, PoE 802.3af/at, max. 30 W or 2-port 10 GbE M12 X-coded, the nROK 7271 retains the flexibility to meet the demands of different rolling stock applications such as infotainment, transportation cellular routers, video servers and video surveillance.

Processor Intel® 12th/13th Gen Core™ CPU (65W/35W), Chipset: Intel R680E, Graphics: Intel® UHD Graphics 770, 1.55GHz
Memory 2 x 262-pin SO-DIMM, DDR5 4800MHzMaximum 64 GB, ECC and dual-channel support
Video Output 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz1 x VGA, up to 1920 x 1200@60Hz
Storage 2 x 2.5” SATA 3.0 external SSD (15 mm height, removable)1 x mSATA (shared mini-PCIe slot)2 x M.2 Key B (full M.2 socket)1 x microSD card slot, SDXC v3.01
Expansion 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0)2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen 2, SATA 3.0) for LTE/5G NR module with 1 x external dual nano-SIM1 x M.2 2230 Key E socket (USB 2.0, PCIe 3.0 x2), BOM optional M.2 2230 Key E socket (USB 2.0, PCIe 3.0, PCIe 3.0)
GNSS and Onboard Sensor 1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS/Glonass/Galileo/Beidou1 x 3D accelerometer and 3D gyroscope
LAN and Power over Ethernet nROK 7271-WIC4:
- 1-port LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226 GbE (WOL support)
- 4-port Independent LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226-IT GbE, PoE 802.3af/at, max. 60 W, non-isolated (without PoE expansion card) / 30 W (with PoE expansion card)
nROK 7271-WI:
- 2-port LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226 GbE (WOL support)
Security TPM 2.0: InfineonSLB9665TT2.0FW5.62
I/O Interface - Front 4 x LED indicators (storage/WWAN/WLAN/programmable)1 x HDMI 2.0a/b2 x USB 3.2 Gen 2 type A (5V/0.9A)2 x Externally accessible dual nano-SIM card slots with cover1 x microSD card slot with cover2 x 2.5” removable SSD trays1 x Reset button1 x Power buttonnROK 7271-WIC4:
- 1 x M12 X-coded LAN port
- 4 x M12 X-coded PoE 802.3af/at
nROK 7271-WI:
- 2 x M12 X-coded LAN ports
1 x Fan power connector1 x SMA connector for GNSS4 x SMA connector holes for WWAN2 x Externally accessible dual nano-SIM card socket holes with cover, 8 x SMA connector holes for WWAN and 2 x RP-SMA connector holes for WLAN (reserved for 5G/Wi-Fi expansion card)
I/O Interface - Rear 1 x VGA1 x M12 A-coded 8-pin for 2 x USB 2.01 x M8 (AUDIO) for 1 x Mic-in, 1 x Line-out2 x DB9 (COM1/2) for full RS232/422/485 (isolated)1 x DB15 (CAN/DIO)
- 2 x Isolated CAN FD, compatible with CAN2.0A/2.0B
- 4 x DI and 4 x DO (isolated), power at source for DIO isolation, 14~48VDC
1 x M12 K-coded 5-pin for power input1 x 2-pin connector for ignition input4 x SMA connector holes for WWAN4 x RP-SMA connector holes for WLAN
Power Management and Software Support Power input 24~110VDC isolated (occupies rear-side expansion)Optional 2.2~3 sec (170W~120W) protection against transient voltage drops (with supercapacitor card, occupies rear-side expansion)Software-selectable startup and shutdown voltage for low-power protectionSoftware-adjustable 8-level power on/off delay timeSupports S3/S4 suspend mode10~255 seconds WDT support, set up via softwareSDK (Windows/Linux) including utility and sample code
Operating System Windows 11/Windows 10/Linux
Dimensions 260 x 210 x 110 (G x D x Y) (mm)
Weight nROK 7271-WIC4: 6.98 kgnROK 7271-WI: 6.93 kg
Environment Operating temperatures
- EN 50155, class OT3 (-35°C ~70°C), 85°C for 10 minutes (with 35W TDP CPU, 60W PoE, 8GB memory, industrial SSD) with airflow
Storage temperatures: -40°C to 80°CRelative humidity: 90% (non-condensing)Vibration (random)
- 2g@5~500 Hz (operating, SSD)
Vibration (SSD)
- Operating: MIL-STD-810H, Method 514.8C, Procedure 1, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810H, Method 514.8E, Procedure 1, Category 24, minimum integrity test
Shock (SSD)
- Operating: MIL-STD-810H, Method 516.8, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810H, Method 516.8, Procedure V, crash hazard shock test=75g
Certifications CE/UKCA/FCC Class AEN 50155: 2021
- Ambient temperature EN 50155, Class OT3 (-35°C ~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1, S2 (with supercapacitor card), S3 (with supercapacitor card)
- Supply change class C1, C2 (with supercapacitor card)
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2 on request)
EN 45545-2: 2020+A1: 2023
Options Intel® Core™ CPU:
- i9-12900E/12900TE, Cores: 16c, Max Frequency: 5.0/4.8GHz, TDP: 65W/35W
- i7-12700E/12700TE, Cores: 12c, Max Frequency: 4.8/4.6GHz, TDP: 65W/35W
- i5-12500E/12500TE, Cores: 6c, Max Frequency: 4.5/4.3GHz, TDP: 65W/35W
- i3-12100E/12100TE, Cores: 4c, Max Frequency: 4.2/4.0GHz, TDP: 60W/35W
SO-DIMM DDR5-4800MHz:
- 64GB (future), 32GB, 16GB, 8GB
FAN Kit
- Model No.: VTK FAN120-02, Description: 120mmx120mm, P/N: 10VK00FAN02X0
* Note: A 65W CPU must be supplied with the fan kit
Please enable JavaScript in your browser to complete this form.
Click or drag a file to this area to upload.

Mobile Computer Solutions

Looking for a product?

We help you find the products you need quickly and easily. At Valen Bilişim, we offer the solutions best suited to your business with our wide product range.