Nexcom Train Computer – nROK 7252-AC8S

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Nexcom Train Computer – nROK 7252-AC8S

ntel® 8th/9th Gen Core™/Xeon® CPU Fanless Railway Vehicle Computer

Key Feature

  • Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU
  • Supports six SIM cards + three WWAN modules
  • LTE/5G WWAN module support
  • 4 x External SSD (compatible with 15 mm drives) for RAID 0, 1, 5, 10
  • 2 x mSATA (full mini-PCIe slot)
  • EN 50155, class OT4 compliance
  • Three video outputs, one VGA and two HDMI
  • 3 x mini-PCIe + 2 x M.2 socket expansion
  • 1 x SD card to export and back up data

Request a Quote Datasheet

The NEXCOM nROK 7252 system delivers operational efficiency for public transport and service. Intel ® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon ® LGA1151 socket-type CPU and 8-port 802.3 af/at PoE form the basis of an integrated solution that houses high computing power. With dual SIM card support per modem, six SIM cards can back each other up for better connection quality by software. In addition, the six SIM card and three WWAN module architecture can increase bandwidth for a faster data transmission speed. RAID 0, 1, 5, 10 with 4 x external SSD guarantees data security. The nROK 7252 retains the flexibility to meet the demands of different rolling stock applications such as infotainment, transportation cellular routers, video servers and video surveillance.

Processor Supports 9th/8th Gen Intel® Core™ i7/i5/i3, Xeon® LGA1151 socket
- Intel® Core™ i7-9700TE/i7-8700T, TDP 35W
- Intel® Core™ i5-9500TE/i5-8500T, TDP 35W
- Intel® Core™ i3-9100TE/i3-8100T, TDP 35W
- Intel® Xeon® E-2278GEL, TDP 35W
- Intel® Celeron® G4900T, TDP 35W
Chipset Intel® C246 Platform Controller Hub
Memory 2 x 260-pin DDR4 SO-DIMM sockets up to 32 GB/channel (64 GB for two channels)Supported ECC memory: i3-9100TE/i3-8100T, E-2278GEL, G4900T
Video Output Chipset Intel® UHD Graphics 6302 x HDMI 1.4b up to 4096 x 2160 at 30Hz1 x VGA up to 1920 x 1200 @ 60Hz
Storage 4 x 2.5” SATA 3.0 external SSD (15 mm)2 x mSATA (full mini-PCIe slot)1 x Removable SD 3.0
Expansion 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA)1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA), BOM optional M.2 3042 Key B socket (USB 2.0, USB 3.1 Gen 1) for LTE/5G NR module with 2 x external SIM1 x Full-size mini-PCIe socket (USB 2.0, USB 3.1 Gen 2 (BOM optional)) for LTE module, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM
GNSS and Onboard Sensor 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/BeidouG-Sensor (3-axis, 10-bit resolution)
LAN and Power over Ethernet 2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (iAMT support) GbE8-Port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W
Security TPM 2.0: Infineon SLB9665TT2.0FW5.62
I/O Interface - Front 24 x LED indicators (including 3 x programmable LEDs)2 x HDMI 1.4b1 x VGA1 x USB 3.1 Gen 2 type A (5V/1A)1 x USB 3.1 Gen 1 type A (5V/1A)6 x Externally accessible SIM card sockets with cover4 x 2.5” removable SSD trays1 x SD with cover1 x Reset button1 x Power button10 x SMA antennas
I/O Interface - Rear 2 x LAN M12 X-coded, I210/I219 10/100/1000 Mbps8 x PoE 802.3af/at (max. 60W), M12 X-coded1 x Mic-in, 2 x Line-out (AUDIO, DB9, female)1 x M12 A-coded connector for 2 x USB 2.02 x USB 3.1 (5V/1A) type A2 x DB9 (COM1/COM2) for full RS232 (isolated)1 x DB9 (COM3) for full RS232/422/485 (isolated)1 x DB15 (CAN/DIO)
- 1 x Isolated CANBus 2.0B
- 4 x DI and 4 x DO (isolated)
- Power input for DIO isolation, 9~48VDC1 x Waterproof DC input connector with ignition
- DC 24V/36V (non-isolated)3 x SMA antennas
Power Management and Software Support Power input 24VDC/36VDC non-isolatedSoftware-selectable startup and shutdown voltage for low-power protectionSoftware-adjustable 8-level power on/off delay timeSupports S3/S4 suspend mode10~255 seconds WDT support, set up via softwareSDK (Windows/Linux) including utility and sample code
Operating System Windows 10/Linux
Dimensions 260 x 266 x 110 (G x D x Y) (mm)
Weight 6.8 kg
Environment Operating temperatures: EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (with industrial SSD) with airflowStorage temperatures: -40°C to 80°CRelative humidity: 90% (non-condensing)Vibration (random)
- 2g@5~500 Hz (operating, SSD)Vibration (SSD)
- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity testShock (SSD)
- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
Certifications BUFCC Class AEN 50155: 2017
- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1
- Supply change-over class C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, on request)EN 45545-2:2013+A1:2015 (PCB)
Manual (Please Contact the Sales Department )
Date Description Version OS Download
2022-03-10 User Manual (Datasheet Only) Windows 0.86 MB
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