Nexcom Train Computer – nROK 1031/1031-C2

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Nexcom Train Computer – nROK 1031/1031-C2

Fanless Rolling Stock Computer with Intel Atom® 6413E Processor

Key Feature

  • Intel Atom® x6413E quad-core processor, 9W
  • Compact and fanless design
  • 5G NR and Wi-Fi 6/6E wireless communication options
  • Onboard U-blox M9N GNSS
  • Built-in 1 x CAN bus 2.0B (optional SAE J1939)
  • 1 x mini-PCIe + 2 x M.2 socket expansions
  • 2 x PoE support, total 60W (nROK 1031-C2)
  • Dual display outputs
  • Optional AI accelerator M.2/mPCIe module
  • CE/UKCA/FCC/EN 50155 approved

Request a Quote Datasheet

The nROK 1031 features the new-generation Intel Atom® x6413E processor, quad-core 1.5 GHz, with powerful graphics and multimedia enhancements. It offers built-in CAN 2.0B, an optional OBD interface (SAE J1939) for vehicle diagnostics, and an advanced GNSS receiver supporting GPS+QZSS/Glonass/Galileo/Beidou. In addition, optional WLAN (Wi-Fi 5/6/6E) and optional WWAN (LTE/5G NR) provide wireless data for connectivity. With convenience in mind, it has dual micro SIM and one micro SIM with an external access design, allowing users to easily access the micro SIM card. Equipped with an optional AI accelerator M.2/mPCIe module, the nROK 1031 also functions as a reliable AI edge computing platform, enabling innovative AI solutions for rolling stock. With a rugged, fanless and compact enclosure, this fanless computer can be installed easily.

The nROK 1031-C2 provides dual IEEE 802.3af/at PoE function and is suitable for most PoE devices. This includes connection to wireless access points and IP cameras. In addition, an extra 12VDC output for an external display can be provided through easy power cable arrangements. The nROK 1031 is a flexible railway vehicle computer that meets the various demands of train applications such as wireless gateways, infotainment, dispatch systems, AI edge computing and mobile video surveillance.

 

Processor Intel Atom® x6413E quad-core processor, 1.5 GHz, TDP 9 W
Memory 1 x 260-pin DDR4 SO-DIMM socket supports up to 32 GB at 3200MHz. Default 2666MHz, 4 GBWith In-Band ECC (IBECC)
Video Output 1 x HDMI 1.4b up to 3840 x 2160@30Hz1 x VGA port 1920 x 1200@60Hz
Storage 1 x 2.5” SATA 3.0 internal drive bay (9.5 mm)1 x M.2 2280 Key M for SATA 3.0
Expansion 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0), BOM optional M.2 3042 Key B socket (USB 2.0, USB 3.2 Gen 2) for LTE/5G NR module with 1 x internal micro SIM and 1 x external micro SIM1 x M.2 2230 Key E socket (USB 2.0, PCIe 3.0 x2), BOM optional M.2 2230 Key E socket (USB 2.0, PCIe 3.0, PCIe 3.0)1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen 2) for LTE/5G NR module with 1 x internal micro SIM and 1 x external micro SIM
GNSS and Onboard Sensor 1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS/Glonass/Galileo/Beidou1 x 3D accelerometer and 3D gyroscope
LAN and Power over Ethernet 1-Port LAN M12 X-coded, 10/100/1000/2500 Mbps Ethernet, Intel® Ethernet Controller I225-IT (WOL support)1-Port LAN M12 X-coded, 10/100/1000 Mbps Ethernet, Marvell Ethernet PHY 88E15122-Port LAN M12 X-coded, 10/100/1000/2500 Mbps Ethernet, PoE 802.3af/at, max. 60 W, isolated (nROK 1031-C2)
Security TPM 2.0: Infineon SLB9670VQ2.0 FW7.62
I/O Interface - Front 6 x LED indicators (including 1 x programmable LED)1 x USB 3.2 Gen 2 type A (5V/0.9A)1 x USB 2.0 type A (5V/0.5A)1 x Externally accessible micro SIM card sockets with cover1 x Reset button1 x Power button1 x DB9 (COM) for full RS232/422/4851 x DB9 (Audio) for 1 x Mic-in, 1 x Line-out1 x DB9 for expansion port (optional)2 x M12 X-coded PoE, including 2 x PoE LED lights (nROK 1031-C2)4 x SMA connector holes for WWAN (nROK 1031)
I/O Interface - Rear 1 x HDMI1 x VGA1 x LAN (LAN1) M12 X-coded, 10/100/1000/2500 Mbps1 x LAN (LAN2) M12 X-coded, 10/100/1000 Mbps1 x M12 A-coded 8-pin for 2 x USB 2.0 (5V/0.5A)1 x DB26 (MULTI PORT)
- 1 x Isolated CANBus 2.0B
- 1 x RS232 Tx/ Rx
- 1 x GNSS speed/direction
- 5 x DI and 4 x DO
- 2 x RS485
- 12V/ 2A DC output
- GND1 x M12 A-coded 5-pin for power/ignition input1 x SMA connector for GNSS2 x SMA connector holes for WWAN3 x RP-SMA connector holes for WLAN
Power Management and Software Support Power input 24VDC (9~36VDC) non-isolatedCranking voltage: 6V~9V (< 30 seconds)Reverse protection, OCP and UVPSoftware-selectable startup and shutdown voltage for low-power protectionSoftware-adjustable 8-level power on/off delay time10~255 seconds WDT support, set up via softwareSDK (Windows/Linux) including utility and sample code
Operating System Windows 11/Windows 10/Linux
Dimensions 180 mm (W) x 180 mm (D) x 60 mm (H)
Weight nROK 1031: 2.08 kgnROK 1031-C2: 2.2 kg
Environment Operating temperatures
- EN 50155, class OT4 (-40°C ~70°C), 85°C for 10 minutes (with industrial SSD) with airflowStorage temperatures: -40°C to 85°CRelative humidity: 90% (non-condensing)Vibration (random)
- 2g@5~500 Hz (operating, SSD)Vibration (SSD)
- Operating: MIL-STD-810H, Method 514.8C, Procedure 1, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810H, Method 514.8E, Procedure 1, Category 24, minimum integrity testShock (SSD)
- Operating: MIL-STD-810H, Method 516.8, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810H, Method 516.8, Procedure V, crash hazard shock test=75g
Certifications BUUKCAFCC Class AEN 50155: 2017
- Ambient temperature EN 50155, Class OT4 (-40°C ~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1
- Supply change class C1
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2 on request)EN 45545-2: 2020 (PCBs)
Driver
Date Description Version OS Download
2023-05-10 Chipset Windows 3.98MB
2023-05-10 CSE Windows 171.1MB
2023-05-10 Ethernet Windows 755.19MB
2023-05-10 Graphics Windows 628.2MB
2023-05-10 PSEIO Windows 1.13MB
2023-05-10 Realtek HD Audio Windows 217.03MB
2023-05-10 SDK Windows 0.86MB
2023-05-10 Serial I/O Windows 0.98MB
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