Nexcom Train Computer - aROK 5510

Nexcom Train Computer – aROK 5510

Powerful Platform for AI Application and Storage Server with Intel® Core™ 8th/9th Gen/Xeon® CPU and Rich Storage Space

Key Feature

Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU
Supports graphics card with 100W power consumption
Supports eight SIM cards + four WWAN modules
LTE/5G WWAN module support
6 x External SSD for RAID 0, 1, 5, 10
Supports PCIe 3.0 x4 NVMe 1.3 high-performance SSD
EN 50155, class OT4 compliance
3 x mini-PCIe + 3 x M.2 socket expansion
Smart fan design with temperature-based RPMs
Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+
Rack mount platform

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Datasheet

The aROK 5510, a powerful and reliable Artificial Intelligence (AI) platform, is specially designed for rolling stock applications such as rail obstacle inspection, traffic light and traffic sign recognition, pantograph inspection, and high demands on graphics performance. It is equipped with an Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® desktop CPU, and the optional separate graphics card guarantees graphics performance that meets most Automatic Intelligence (AI) requirements. With dual SIM card support per modem, eight SIM cards can back each other up for better connection quality by software. In addition, the eight SIM cards and four WWAN module architecture can increase bandwidth for faster data transfer rates. RAID 0, 1, 5, 10 guarantees the security of the video data on the six external SSDs. The aROK 5510 retains the flexibility to meet the demands of different rolling stock applications such as infotainment, dispatch systems, transportation cellular routers, video servers and video surveillance.

Processor	Supports 8th/9th Gen Intel® Core™ i7/i5/i3 / Xeon® LGA1151 socket - Intel® Core™ i7-9700TE/i7-8700T, TDP 35W - Intel® Core™ i5-9500TE/i5-8500T, TDP 35W - Intel® Core™ i3-9100TE/i3-8100T, TDP 35W - Intel® Xeon® E-2278GEL, TDP 35W - Intel® Celeron® G4900T, TDP 35W
Chipset	Intel® C246 Platform Controller Hub
Memory	4 x 260-pin 2400MHz DDR4 SO-DIMM sockets, up to 32 GB/channel (128 GB for four channels)Supported ECC memory: i3-9100TE/i3-8100T, E-2278GEL, G4900T
Video Output	Chipset Intel® UHD Graphics 6301 x HDMI 1.4b up to 4096 x 2160 at 30Hz1 x VGA up to 1920 x 1200 @ 60Hz
Discrete Graphics Card (optional)	NVIDIA® GEFORCE® GTX 1650 SUPER up to 100W, 1280 CUDA® cores, 4GB GDDR6
Storage	6 x 2.5” SATA external SSD (compatible with 9.5 mm drives)1 x mSATA1 x M.2 2280/2242/2260 Key M socket for SATA 3.0 or PCIe 3.0 x4 NVMe 1.31 x Removable SD 3.0
Expansion	1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0)1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0) for LTE module with 2 x external SIM, BOM optional full-size mini-PCIe socket (USB 2.0)1 x Full-size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen1/PCIe 3.0 (BOM optional), PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM3 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2) for LTE/5G NR module with 2 x external SIM
GNSS and Onboard Sensor	1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/BeidouG-Sensor (3-axis, 10-bit resolution)
LAN and Power over Ethernet	2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (iAMT support) GbE2-Port LAN 10GbE SFP+ (optional)4-Port LAN M12 X-coded, 10/100/1000 Mbps, PoE 802.3af/at, max. 60W (optional)
Security	TPM 2.0: Infineon SLB9665TT2.0FW5.62
I/O Interface - Front	12 x LED indicators (including 2 x programmable LEDs)1 x HDMI 1.4b1 x VGA1 x M12 A-coded connector for 2 x USB2.03 x USB 3.1 Gen 2 type A (5V/1A)1 x USB 3.1 Gen 1 type A (5V/1A)8 x SIM card sockets with cover, externally accessible6 x 2.5-inch removable SSD trays (lockable)1 x SD with cover1 x Reset button1 x Power button20 x SMA antennas2 x LAN M12 X-coded, Intel® I210/I219 (iAMT support) 10/100/1000 Mbps1 x DB9 (AUDIO) for 1 x Mic-in, 2 x Line-out2 x DB9 (COM1/COM2) for full RS232 (isolated)2 x DB9 (COM3/COM4) for full RS232/422/485 (isolated)1 x DB15 (CAN/DIO) - 1 x Isolated CANBus 2.0B - 4 x DI and 4 x DO (isolated) - Power input for DIO isolation, 9~48VDC1 x Waterproof DC input connector with ignition - 24VDC input with 2.5KVDC isolation - 110VDC input with 2.5KVDC isolation
I/O Interface - Rear	4 x Smart fans (replaceable) for system cooling
Power Management	Power input 24VDC/110VDC isolatedSoftware-selectable startup and shutdown voltage for low-power protectionSoftware-adjustable 8-level power on/off delay timeSupports S3/S4 suspend mode0~255 seconds WDT support, set up via softwareSDK (Windows/Linux) including utility and sample code
Operating System	Windows 10/Linux
Dimensions	483 x 400 x 95 (W x D x H) (mm) *Please reserve a total height of 3U in the rack for the ROK 5510
Weight	8.5 kg
Environment	Operating temperatures: EN 50155, class OT4 (-40~70°C), 85°C for 10 minutes (with 35W TDP CPU, 100W TDP GPU, industrial SSD) with airflowStorage temperatures: -40°C~80°CRelative humidity: 90% (non-condensing)Vibration (random) - 2g@5~500 Hz (operating, SSD)Vibration (SSD) - Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure - Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity testShock (SSD) - Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g - Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
Certifications	BUFCC Class AEN 50155: 2017 - Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes - Interruptions of voltage supply class S1 - Supply change-over class C1, C2 - EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 - Shock and vibration IEC 61373 Class B - Protective coating class PC1 (PC2, on request)EN 45545-2: 2013+A1:2015 (PCB)

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Nexcom Train Computer – aROK 5510

Nexcom Train Computer – aROK 5510

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