Nexcom Tren Konsolu – vROK 3030

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Nexcom Tren Konsolu – vROK 3030

10.4” Railway Open-Frame Panel Computer with Intel Atom® x6414RE Processor

Key Feature

  • Intel Atom® x6414RE quad-core processor, 9W
  • 10.4-inch TFT LCD monitor with PCAP touch (BOM optional)
  • IPS LCD with wide viewing angle and 1024 x 768 resolution
  • Sunlight readability: 1,200 nit LCD brightness
  • LCD monitor, 1 x HDMI, 1 x DP video output for triple displays
  • Isolated CANBus 2.0 x 1
  • CVBS input x 4 for analog cameras (works with an optional capture card)
  • PoE supported for 2 x IP cameras (optional)
  • Open-frame design for a wide variety of form factors
  • Certified for railways to EN 50155, class OT3 (-30°C~70°C)

Request a Quote Datasheet

The vROK 3030, a 10.4-inch all-in-one railway open-frame panel computer, is designed for human-machine interface (HMI) and passenger information systems in railway applications. It implements the latest Intel Atom® x6414RE processor on both Windows and Linux platforms. For security, it can support 4 x analog cameras (works with an optional capture card) or 2 x PoE cameras (optional). The 1,200 nit LCD panel guarantees sunlight readability. For passenger information, advertising or in-vehicle infotainment, it offers triple displays with an LCD monitor, 1 x HDMI and 1 x DP video output. A design with 1 x mini-PCIe slot and 2 x M.2 slots is supported for mSATA/capture card for data transfer and WLAN/WWAN wireless connectivity. The open-frame design can be integrated into a wide variety of configurations and form factors.

LCD Panel 10.4-inch TFT LCD panel with LED backlight1024 x 768 pixelsBrightness: 1200 cd/m² (typical)Viewing angle: 170° (V)/170°(H)Contrast ratio: 900:1 (typical)
Touchscreen (BOM optional) Projected capacitiveAnti-glare coated surfaceTransmittance: 85% ± 3
Processor Intel Atom® x6414RE quad-core processor, 1.5 GHz, TDP 9W
Memory 1 x 260-pin DDR4 SO-DIMM socket supports up to 32 GB at 3200MHz. Default 2666MHz, 4 GBWith In-Band ECC (IBECC)
Video Output 1 x HDMI 1.4b up to 3840 x 2160@30 Hz1 x DP 1.4 up to 4096 x 2160@60 Hz
Storage 1 x M.2 2280 Key M socket (SATA 3.0 or PCIe 3.0 x1)1 x mSATA (shared mini-PCIe slot)
Expansion 1 x M.2 2230 Key E socket (USB 2.0, PCIe 3.0 x2)1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0)1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen2) for LTE/5G NR module, BOM optional 1 x Full-size mini-PCIe socket (USB 2.0, USB 3.2 Gen2 (BOM optional)) for LTE module, 1 x external micro SIM slot, 1 x internal micro SIM slot
GNSS and Onboard Sensor 1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS /Glonass/Galileo/Beidou1 x 3D accelerometer and 3D gyroscope
LAN and Power over Ethernet 2-port LAN M12 X-coded, 10/100/1000/2500 Mbps, Intel® I225-IT (optional PoE 802.3af/at, max. 30 W, with VIOD-POE2-01)
Security TPM 2.0: Infineon SLB9670VQ2.0 FW7.62
I/O Interface-Side Right Side
- 1 x System reset button
- 1 x USB 3.2 Gen2 type A connector
- 1 x Micro-SIM slot with cover
I/O Interface - Rear 2 x DB9 (COM1/COM2) for full RS232/RS422/RS485 (with isolation)1 x Power connector, M12 A-coded 5-pin2 x 10/100/1000/2500 Mbps LAN, M12 X-coded 8-pin1 x M12 A-coded 8-pin for 2 x USB 2.01 x Line-in (stereo), 2 x Line-out (stereo) (AUDIO, DB9, female)1 x HDMI output1 x DP output1 x M12 (MULTI PORT, A-coded 17-pin)
- 4 x DI (isolated)
- 2 x DO (isolated)
- Power input for DIO isolation, 14~48VDC
- 1 x Isolated CANBus 2.0B
- 1 x Power button
- 4 x Composite video input1 x RP-SMA connector hole for Bluetooth3 x RP-SMA connector holes for WLAN2 x SMA connector holes for WWAN1 x SMA connector for GNSS1 x Ground connector
Mechanical Cooling system: fanlessMuhafaza: metalMounting: open-frame mounting, VESA 75 mountingDimensions: 309 x 230.6 x 67.7 mmCutout size: 212.2 x 159.4 mmWeight: 3.0 kg
Power Management 24/36V DC (14 ~ 48VDC) input, non-isolated24/110V DC input, isolated (BOM optional)Reverse protection, OCP and UVPSoftware-selectable startup and shutdown voltage for low-power protectionSoftware-adjustable 8-level power on/off delay time10~255 seconds WDT support, set up via softwareSDK (Windows/Linux) including utility and sample code
Environment Operating temperatures
- EN 50155, class OT3 (-30°C~70°C), 85°C for 10 minutes (with 9W TDP CPU, industrial SSD) with airflow
- EN 50155, class OT1 (-30°C~60°C), with 9W TDP CPU, industrial SSD, PoE, with airflowStorage temperatures: -40°C to 80°CRelative humidity: 10% to 90% (non-condensing)Vibration (random) 2g@5~500 Hz (operating, SSD)Vibration
- Operating: MIL-STD-810H, 514.8C Procedure 1, Category 4
- Storage: MIL-STD-810H, 514.8E Procedure 1, Category 24Shock
- Operating: MIL-STD-810H, Method 516.6, Procedure I, trucks and semi-trailers = 40g
- Crash hazard: MIL-STD-810H, Method 516.6, Procedure V, ground equipment = 75g
Operating System Windows 10/Windows 11Linux
Standards/Certifications BUFCC Class AEN 50155: 2017
- Ambient temperature EN 50155, Class OT3 (-30°C~70°C)
- Interruptions of voltage supply class S1
- Supply change-over class C1
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, on request)EN 45545-2: 2020 (PCB'ler)
Driver
Date Description Version OS Download
2022-07-19 Audio Windows 217.03MB
2022-07-19 Chipset Windows 3.98MB
2022-07-19 CSE Windows 171.1 MB
2022-07-19 Ethernet Windows 755.19 MB
2022-07-19 Graphics Windows 628.2 MB
2022-07-19 PSEIO Windows 1.13 MB
2022-07-19 SDK Windows 0.86 MB
2022-07-19 Serial I Windows 0.98MB
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