Nexcom Fanless Box PC – NISE 4310-E01

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Nexcom Fanless Box PC – NISE 4310-E01

Intel Atom® x6425E Quad-Core Fanless System

Key Feature

  • Built-in Intel Atom® x6425E quad-core processor, 2.0 GHz
  • 2 x display outputs, 1 x HDMI and 1 x DP port
  • 6 x Intel® I225-IT 2.5GbE TSN LAN ports; supports WoL, teaming and PXE
  • Supports both 2.5-inch and M.2 SATA SSD
  • 1 x mini-PCIe Wi-Fi/LTE wireless module
  • 2 x USB 3.1
  • 4 x USB2.0
  • 2 x DB9 for RS232/422/485
  • 2 x DB9 for RS232
  • Supports -20°C~60°C extended operating temperature
  • Supports 9~30V DC input; supports AT/ATX power mode

Request a Quote Datasheet

Powered by the Intel 11th Gen Atom®x6425E processor. Quad-core, 2.0GHz (formerly code-named "Elkhart Lake"). The NISE 4310 delivers outstanding performance not only in computing but also in graphics, offering a brand-new opportunity for both smart and industrial computing solutions. With up to 16G of DDR4 memory, the NISE 4310-E01 offers a variety of storage options, such as M.2 and 2.5" SATA SSD. The NISE 4310 has high integration capability with an optional Mini PCI-e module (Wi-Fi/LTE), M.2 module (5G/LTE/SATA SSD) and 4 x COM ports (2x RS232 and 2x RS232/422/485), which makes it a truly smart system for various applications such as factory automation, network applications and communication applications. For harsher environments, the NISE 4310-E01 also offers an extended operating temperature SKU of -20 to 60 degrees C.

CPU Support Built-in Intel Atom® x6425E quad-core processor, 2.0 GHz
Main Memory 1 x DDR4 2666 SO-DIMM socket, supports up to 16 GB
Display Option Dual independent displays: HDMI + DP
I/O Interface - Front ATX power on/off switchLED indicators: power status, HDD access, RTC battery low6 x Intel® I225-IT 2.5GbE TSN LAN ports; supports WoL, teaming and PXE2 x USB3.1 ports (900mA each)2 x USB2.0 ports (500mA each)1 x DisplayPort2 x DB9 for COM1 and COM2, auto flow control, supports RS232/422/485 via BIOS setting1 x optional I/F opening for optional function output or module interface use1 x 3-pin DC input, supports +9 to 30VDC input
I/O Interface - Rear 2 x USB2.0 ports (500mA each)1 x 2-pin remote power on/off switch1 x HDMI port2 x DB9 for COM3 and COM4, supports RS232 only2 x connector holes for optional Mic-in / Line-out6 x antenna holes for 5G/LTE/Wi-Fi
I/O Interface - Internal 4 x GPI and 4 x GPO (5V, TTL type)1 x NANO-SIM holderTPM2.0 (optional)Mic-in / Line-out (optional)
Storage Device 1 x 2.5" HDD (SATA 3.0)1 x M.2, supports B, B+M key modules (2242)
Expansion Slot 1 x mini-PCIe socket supports optional Wi-Fi/4G LTE modules1 x M.2 Key B socket supports optional 5G/4G LTE/storage modules
Power Requirements Power input: +9 to 30 Vdc
Dimensions 238 mm (W) x 145 mm (D) x 54 mm (H) without wall-mount bracket
Construction Aluminum chassis with fanless design
Environment Operating temperature:
Ambient with air flow: -20°C to 60°C
(according to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)Storage temperature: -20°C to 80°CRelative humidity: 95% at 40°CShock protection:
- HDD: 20G @ wall mount, half sine, 11ms (operating), IEC60068 2-27
- M.2: 50G @ wall mount, half sine, 11ms (operating), IEC60068 2-27Vibration protection with M.2 and SSD:
- Random: 2Grms @ 5~500 Hz, IEC60068-2-64
- Sinusoidal: 2Grms @ 5~500 Hz, IEC60068-2-6
Certifications CE approval
- EN61000-6-2
- EN61000-6-4FCC Class A
Supported Operating Systems Windows 10 IoT Enterprise, 64-bitWindows 11Linux Kernel Version 4.1
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