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  • VTC 1010
  • VTC 1010
  • VTC 1010
  • VTC 1010

VTC 1010

Intel® Atom™ E3827 Fanless In-Vehicle Computer

  • IIntel® Atom™ processor E3827, 1.75GHz
  • Dual SIM cards + dual WWAN modules support
  • Wide operating temperature -30°C- 70°C
  • Built-in U-blox 6 GPS, optional Dead Reckoning support
  • Built-in CAN 2.0B. Optional OBDII function (SAE J1939/ J1708)
  • 4x mini-PCIe rich expansion capability
  • Wake on RTC/ SMS via WWAN module
  • Compliant with MIL-STD-810G
  • Built-in UBX-G6010 GPS, optional Dead Reckoning support
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NEXCOM’s in-vehicle computer, VTC 1010, provides the performance, reliability and scalability required to build a connected vehicle that can address the needs of fleet management. Based on the Intel® Atom™ processor E3800 product family (formerly codenamed "Bay Trail"), VTC 1010 features wide operating temperature range, dual WWAN and SIM, built-in GPS with optional dead-reckoning, intelligent vehicle power management and four mini-PCIe expansions. in-vehicle computer VTC 1010 can deliver the telematics technology for real-time voice and data communication, vehicle tracking and navigation, mobile video surveillance as well as in-vehicle infotainment.

CPU
  • Intel® Atom™ İşlemci E3827, Çift Çekirdek 1.75GHz
Bellek
  • 1 x 204-pin DDR3L SO-DIMM socket support 1066MHz/ 1333MHz up to 8GB. Default 2GB
Hafıza
  • 1 x 2.5" SATA 2.0
  • 1 x external accessible SD card socket
Genişleme Yuvası
  • 1 x full size Mini-PCIe socket (USB 2.0)
  • 1 x full size Mini-PCIe socket (USB 2.0+ PCIe)
  • 1 x full size Mini-PCIe socket (mSATA or PCIe)
  • 1 x half size Mini-PCIe socket (USB 2.0 + PCIe)
Function;
  • 1 x default U-blox UBX-G6010 GPS module (50-channel and GALIELO) or optional modules with Dead Reckoning or GLONASS support
  • Built-in G-sensor, Gyroscope, and e-Compass sensors
Giriş/Çıkış Portları(Ön)
  • 8 x LED for power, system status, storage, WWAN, WLAN, GPS, LAN, GPIO
  • 2 x external accessible SIM card socket (selectable) with cover
  • 1 x audio jack 3.5mm for WWAN voice communication, including 1 x Mic-In and 1 x Line-Out
  • 1 x external accessible SD card socket with cover
  • 1 x event button (trigger type)
  • 1 x reset button
  • 1 x type A USB 3.0 compliant host, supporting system boot up
Giriş/Çıkış Portları(Arka)
  • 1 x 9~36VDC input with ignition and 11W typical power consumption
  • 1 x type A USB 2.0 compliant host, supporting system boot up
  • 1 x RJ45 10/100/1000 Fast Ethernet with LED
  • 1 x phone jack 3.5mm for 1 x Mic-In (for WWAN voice communication)
  • 1 x phone jack 3.5mm for 1 x Line-Out (for PC audio)
  • 1 x DB-15 VGA. Resolution up to 2560 x 1600 @60Hz
  • 1 x DP port. Resolution up to 2560 x 1600 @60Hz
  • 1 x DB-9 for RS-232
  • 4 x antenna hole for GPS/ WWAN/ WLAN/ B 1 x LHF 60-pin connector
  •     1 x 6-pin power connector, 12VDC output (max: 1A)
  •     1 x type A female USB 2.0 compliant host, supporting system boot up
  •     1 x DB-9 RS-232
  •     1 x DB-9 RS-422/ 485
  •     1 x DB-9 female 3 x DI and 3 x DO. On board CAN 2.0B signals
    •     (Programmable Digital Input)
    •       Input Voltage (Internal Type): 5VDC TTL (default)
    •       Input Voltage (Source Type): 3~12VDC
    •     (Programmable Digital Output)
    •       Digital Output (Sink Type): 5VDC TTL (default), max current: 20mA
    •       Digital Output (Source Type): 3~24VDC, max current: 250mA
  •     1 x DB-9 for optional ODBII module (ASE J1939 or J1708)
  •     1 x DB-9 for optional GPS Dead Reckening module
  •     4 x BNC connector Video-In for optional 4-channel video capture card
  •     4 x audio connector for 7.1 channel audio output
  •     (front, center/ woofer, rear surround, side surround)
Güç Yönetimi
  • Selectable boot-up & shut-down voltage for low power protection by software
  • Setting 8-level power on/ off delay time by software
  • Status of ignition and low voltage can be detected by software
  • Support S3/ S4 suspend mode
İşletim Sistemi Destekleri
  • Windows 8 Professional, WES8
  • Windows 7, WES7
  • Tizen IVI
  • Fedora
Boyutlar
  • 180 mm (W) x 180 mm (D) x 50 mm (H) (7.09" x 7.09" x 1.97")
  • 1.7kg
Ortam Koşulları
  • Çalışma Sıcaklığı:
    • -30°C to 70°C (w/ industrial SSD) with air flow
    • -20°C to 50°C (w/ commercial HDD) with air flow
  • Depolama Sıcaklığı: -35°C to 85°C
  • Nem: 10% to 90% (non-condensing)
  • Titreşim (random): 1g@5~500 Hz (in operation, SSD)
  • Titreşim (SSD):
    • Çalışma: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
    • Depolama: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test
  • Şok (SSD):
    • Çalışıyorken: MIL-STD-810G, Method 516.6, Procedure I, functional shock=20g
    • Çalışmıyorken: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
Sertifikalar
  • CE Onaylı
  • FCC Class B
  • E13 Mark